Foundry services in the MST Lab&Fab
In addition to complete MEMS solutions, Fraunhofer IMS also offers foundry services in the Microsystems Lab&Fab. The clean room has lithography down to 0.35µm with the possibility to align back to front with 200 nm accuracy. In addition to standard coatings, coating thicknesses of up to 40 µm are possible, as well as colored coatings. Dedicated equipment can be used to bond fully integrated wafers (direct-wafer bonding) or individual circuits on wafers (chip-to-wafer-bonding). For plasma processes, sputtering (PVD), plasma-enhanced deposition (PE-CVD) and reactive etching (RIE) as well as deep etching (DRIE) are available. Further specialties here are the deposition of pure boron as ultra-thin passivation or contacting, silicon carbide, germanium as well as differently doped amorphous silicon. By means of electroplating, layers and structures up to 40 µm can be created from gold, copper, tin and nickel. Atomic Layer Deposition (ALD) is suitable as a highly conformal, biocompatible passivation as well as for many MEMS applications due to its excellent conformality. A variety of oxides and nitrides as well as metallic layers such as titanium nitride and ruthenium are possible here.
The above processes are all suitable for post-CMOS integration due to low process temperatures. Extensive characterization and analytics support the development and enable precise product controls. For this purpose, the MST Lab&Fab has a 3D microscope, an atomic force microscope (AFM), an electron microscope (SEM) with EDX, a scanning electron microscope for critical structures (CD-SEM), ellipsometers and profilometers.
Details about MEMS technologies at Fraunhofer IMS can be found in the links below.