Press Releases

What happens inside the body while we sleep, work, or go about our daily lives? Heartbeats, blood flow, and other physiological processes continue uninterrupted—mostly hidden from view, often measurable only intermit-tently. In the future, smart sensors could help continuously monitor such changes: precisely, discreetly, analytically, and right where they occur. The Fraunhofer Institute for Microelectronic Circuits and Systems IMS will showcase the technological foundations required for this at COMPAMED 2026, November 16–19, at the IVAM joint booth in Hall 8A, Booth G19.4: implantable pressure sensors, photonic detec-tors, and ultra-thin functional coatings.

Fraunhofer is making hydrogen applications safer and more cost-effective: In the RADIANT joint project, Fraunhofer Institute for Microelectronic Circuits and Systems IMS, Fraunhofer Institute for Applied Solid State Physics IAF, and Fraunhofer Center for Applied Photonics CAP (Glasgow, UK) are develop-ing a novel, compact Raman LiDAR system. It reliably detects gas leakages, particularly hydrogen, from a distance, even under challenging environmen-tal conditions. For operators of energy facilities and industrial process envi-ronments, this means early detection without risk to personnel, continuous monitoring, and scalable solutions for real-world deployment.

In the GenSATIOn-Edge project, the Fraunhofer Institute for Microelectronic Circuits and Systems IMS is collaborating with partners to develop intelligent sensor systems for the continuous monitoring of industrial processes. AI models run directly on edge devices, enabling adaptive process monitoring without the need for the cloud. Initial results show that processes can be analyzed in real time, quality deviations can be detected early, and maintenance can be planned as needed.

The Fraunhofer Alliance for Big Data and Artificial Intelligence annually supports practical AI solutions that address specific industrial challenges. A jury of business unit leaders has now selected five winning projects from 20 ideas—Fraunhofer IMS is represented with two projects.

Ultra-precise, compact, and robust: As part of the PISA project, Fraunhofer IMS is collaborating with Fraunhofer ISIT to develop an integrated feedback element for ultra-stable, narrow-band lasers. The combination of integrated photonics and piezoelectric surface waves enables compact, vibration-insensitive solutions for quantum and precision applications. The goal is to integrate complex laboratory setups onto a single chip, thereby paving the way for scalable, industry-ready solutions.

The »Edge AI Platform« project is entering its third funding round: Three Fraunhofer Institutes are continuing to develop the platform into version 3.0 to provide companies with even more efficient access to embedded artificial intelligence (AI) and to significantly accelerate the integration of intelligent functions into products.

In the miniLIDAR collaborative project, funded by the Federal Ministry for Economic Affairs and Energy (BMWE), Jena-Optronik GmbH, a Leibniz Institute, and several Fraunhofer Institutes have jointly developed a novel LiDAR system for space applications. The result is an innovative, SPAD-based system that is significantly more compact, lighter, and more energy-efficient than previous solutions, while also meeting the demands of spaceflight.

Beginning Immunotherapies open up new possibilities in cancer treatment, but they also carry cardiovascular risks. Led by the University Hospital Essen, the I-CHECK-HEART project is developing an AI-supported solution for structured and personalized cardio-oncological follow-up care. The Fraunhofer Institute for Microelectronic Circuits and Systems IMS is contributing its expertise in intelligent sensor and vital sign analysis to enable early risk detection and sustainably improve patient care.

In the CHOPS joint project, the Fraunhofer Institute for Microelectronic Circuits and Systems IMS is working with partners to develop an open design process for photonic-electronic chips. The aim is to better integrate development, packaging, and manufacturing and to map them in a consistent open-source environment. In this way, the project strengthens the innovative power and technological independence of European microelectronics.