Fraunhofer Institute for Microelectronic Circuits and Systems
Post-CMOS PIC layer stack.
Photonic Integrated Circuits (PICs)
Photonics and electronics on a single chip: Flexible photonic platform for a broad spectrum of wavelengths.
© Fraunhofer IMS
Photonic Integrated Circuits (PICs)
Our flexible post-CMOS photonics platform supports a wide range of wavelengths and features (ultra-)low-loss waveguides that ensure high energy efficiency. Post-CMOS processing enables a unique convergence of photonics and electronics through quasi-monolithic integration on a single chip.
From concept to pilot series
Post-CMOS Integration: waveguides are integrated on a planarized CMOS chip.
With our Photonic Integrated Circuit (PIC) technology, we offer innovative solutions for a wide range of applications in areas such as sensor technology, photonic data processing, and quantum technologies.
Our post-CMOS-compatible technology enables photonic integration on foundry wafers, allowing the combination of photonic and electronic components on a single wafer. The photonic waveguides are manufactured on 200 mm wafers, ensuring high production capacity and scalability.
Thanks to our extensive experience in CMOS and photonics, we are the ideal partner for process development, transfer, and scaling. We support our customers from the concept phase through to series production and offer customized solutions tailored to specific requirements.
We offer services at every stage of the development process, from designing a product concept that meets your expectations to delivering reliable, high-quality solutions.
Our technology platform is accessible through R&D collaborations and bilateral projects, as well as through publicly funded collaborative projects.
Photonic platform
SiN waveguide with thermo-optical phase modulator under test.
Ring resonator realized in 360 nm thick PECVD silicon nitride.
We develop photonic circuits and systems based on dielectric materials. Our platform includes standard silicon nitride photonics as well as aluminum nitride and tantalum pentoxide. We also offer flexible integration processes for other materials in order to utilize their optical properties.
Silicon nitride photonics is characterized by low losses, no two-photon absorption, and a broad wavelength spectrum from 400 nm to approximately 3 µm. Photonic components such as couplers, waveguides, ring resonators, thermo-optical phase shifters, and more are already available on our platform.
Thanks to our extensive experience in microelectronics manufacturing, we can offer high-quality, reliable components and circuits that are manufactured in our modern clean room with high yield. Our clean room is quality-assured according to ISO standards and QM-certified, which guarantees reproducible and stable manufacturing at the highest level.
In addition, we have extensive measurement capabilities that allow us to evaluate and verify designs ourselves. This ensures that our photonic components and systems meet the highest performance and reliability requirements.
At Fraunhofer IMS, we combine 40 years of experience in the CMOS field with our expertise in photonic integrated circuits. This makes us the ideal partner for implementing your photonics and electronics applications on our flexible platform.
Together, we are continuously developing our photonics platform. Current examples include integrated frequency combs and modulators with novel optoelectronic materials.
Customized processes
Photonic waveguides in our cleanroom.
The integration and application of new materials opens up exciting, innovative functionalities. Manufacturing in our in-house clean room allows us to customize process specifications, giving you the opportunity for application-specific designs. Dimensions and material thicknesses can be customized. We develop customized processes for your pre-processed wafers to meet your exact specifications. We also offer planarization options for the heterogeneous integration of III-V semiconductor components, enabling chip-to-chip and chip-to-wafer integration of laser sources and other active elements.
| Material | Optical loss | Properties and Applications | Desposition Techniques |
| Silicon nitride | Low loss | Post-CMOS and Waveguides only | - Low pressure chemical vapour deposition - LPCVD - Plasma enhanced CVD - PECVD - Sputtering |
| Aluminium nitride | Low loss | Highly transparent up to UV |
Sputtering |
| Tantalum pentoxide | Ultra low loss | Thin waveguide Post-CMOS |
Atomic Layer Deposition (ALD) |
| More in development |
Strong research collaborations
Edge coupling into a SiN waveguide with light at λ = 633 nm.
Our development team at the Fraunhofer IMS works closely with the Photonics Group of the Chair of Electronic Devices and Circuits at the University of Duisburg-Essen. Together, we continuously advance our photonics platform. Current examples include integrated frequency comb lasers and modulators based on novel optoelectronic materials.
The focus lies on the simulation of photonic components and the characterization of fabricated devices. Students and research staff have the opportunity to work at the forefront of research in integrated photonics.
In collaboration with international partners, we address complex integration challenges, incorporate new materials, and serve a broad range of applications.