Services & Know-How in the Field of Devices and Technologies

Use our services and the know-how of the Fraunhofer IMS in the fields CMOS and microsystems technology for the development of innovative and compact microsystems.

The Fraunhofer IMS can rely on 30 years of experience in the area of CMOS technology development and has been focusing especially following areas:

CMOS

• Development and transfer of process modules  for CMOS, e. g. non-volatile memory, analog devices, optical devices and voltage-proof devices
  
• Development of CMOS technologies, for example high-temperature SOI-CMOS technologies on the basis of integrated circuits for the application for application in up to 300 °C
• Realization of extra steps, e. g. surface planarization
• Production of pilot series in the clean room

In addition to the field CMOS, Fraunhofer IMS has the microsystems technology Lab&Fab available and can offer the following services and know-how:

MST process steps

• Deposition and structuring of layers:
• Chemical vapor deposition (CVD) of amorphuous Si, SiO₂, Si₃N₄, SiGe, Ge, SiC, Diamond like  Carbon (DLC)
• Atomic layer deposition (ALD) of Al₂O₃ , Ta₂O₅ , Ru, TiAlCN, TiN, ZnO
  
• Physical layer deposition of metals, for example Ti, TiN, TiW, AlSi, Cu
• Electroplating of Cu, Sn, Ni, Au
• Lithography with precise wafer back-to-front side alignment
  
• Etching processes: ICP, RIE, DRIE, Si deep etching, wet etching
• 3D integration using wafer-to-wafer and chip-to-wafer connections:
  • Direct wafer bonding
  • Solid-liquid interdiffusion bonding (SLID)

Through the combination of CMOS and MEMS processes expertise, Fraunhofer IMS can offer different 3D integration technologies:

MEMS on CMOS

• 3D-Integration of MEMS and CMOS devices or circuits for MEMS-based systems
• Sensor processes
  • Optical detectors
  • Microbolometer arrays for far-infrared sensors
  • Pressure sensors in surface micromechanics
  • Color filters and microlenses for optical devices
    
  • Optical special devices
    
  • Biosensor elements
• Production of pilot series in Fraunhofer IMS CMOS and MST clean rooms