Devices and Technologies

Fraunhofer offers the development of innovative semiconductor solutions including microelectronic and micromechanical devices and systems

Support in Process Development for Individual CMOS or MEMS Devices up to the Complete Process

We support you in the development and integration of innovative microelectronic and micromechanical devices and systems. Profit from our CMOS and MEMS solutions from one provider.

Devices and Technologies

More than Moore trend: In the future the focus will not only be on the size scales, but also on the functionality and efficiency of the systems
© Fraunhofer IMS

More than Moore trend: In the future the focus will not only be on the size scales, but also on the functionality and efficiency of the systems

Double-sided processed wafer as a basis for 3D integration
© Fraunhofer IMS

Double-sided processed wafer as a basis for 3D integration

The development of microelectronics is moving forward rapidly. Apart from the constant reduction of the size of components and the relating increase in the integration density, known as “More Moore”, the increase of the functionality on a chip or microchip is an important goal. The combination of different technologies, also known as “More than Moore”, enables the realization of extremely efficient systems in comparison to a high degree of integration with moderate costs.

Optimized CMOS and MEMS processes allow the integration of further functions, for example high-voltage resistant components, high-frequency circuits, sensors, or the application of the circuit in harsh conditions, like high temperatures. Through the combination with “Micro-Electro-Mechanical Systems” (MEMS), sensor elements like optical, mechanical, physical, chemical and bio sensors can be realized. This way, innovative and extremely compact microsystems for the use in medicine, industry, automotive, aerospace up to consumer applications can be developed.

Fraunhofer IMS provides the optimal conditions:

In the IMS CMOS clean room there is a complete, professionally operated 200 mm CMOS line available with different robust CMOS processes up to a minimal structure size of 0.35 μm.

The integration of new materials or micromechanical structures in a CMOS line is not desirable, because it has to permanently impose restrictions to guarantee the high quality. Therefore the Fraunhofer IMS has developed its own MST line for post processing which is being significantly extended within the framework of “Forschungsfabrik Mikroelektronik Deutschland” (FMD). CMOS wafer serve as an “intelligent” substrate. They receive control and readout circuits, signal processing and conversion and interfaces to the outside up to the wireless energy and data transmission. On these “intelligent substrates” layers are deposited and structured and therefore new, additional components, e. g. MEMS on the CMOS circuits, are realized. This cointegration allows innovative and compact “intelligent” microsystems.

Fraunhofer IMS supports you in the process development for individual CMOS or MEMS devices up to complete process. Moreover, Fraunhofer IMS offers development possibilities up to the complete sensor system.

Overview Pages

Applications

Overview of typical development projects in the field of Devices and Technologies

Technologies

Customer-specific CMOS process, high-temperature ICs, MEMS and post-CMOS processing, atomic layer deposition (ALD), 3D integration

Customer Benefits

Our offers for customer-oriented solutions – from the process development up to series production

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