Infrastructure

The Fraunhofer Institute for Microelectronic Circuits and Systems IMS can look back on 30 years of experience in the development and fabrication of microelectronic circuits and has an efficient infrastructure for the design and the production of ASICs.

Design draft, simulation and verification

For the design draft, simulation and verification of ASICs there is a cluster of high-performance servers available. The design environment is up to the newest industry standards and has access to comprehensive equipment.

CMOS Wafer & Post-Processing

Fraunhofer IMS is your professional partner in the development of process steps, process modules and complete micro/nano sensor systems. We enable our customers to get their microelectronic products from one supplier and offer our know-how, services and infrastructure:

• 0.35 μm CMOS and microsystems Fab with standard CMOS processes for 8-inch wafers in class 10 clean rooms
• MEMS and NEMS technologies, add-on technologies, system integration (with 3D), like electrodes, color filters and microlenses
• Integration of photonic devices and electronics
• Integration of micro and nano sensors in standard CMOS technologies, for example pressure and image sensors
• Post-processing of layers, structures and components on CMOS wafers for the production of compact, intelligent microsystems, like photo cells, IR sensors or biosensors
• Single-process modules: separation, diffusion or echting
• High-temperature SOI-CMOS process with EEPROM for operating temperatures of up to 250 °C
• High-voltage CMOS process (200 V … 1200 V) for half/full-bridge drivers for control of MOS/IGBT power components
• ASIC foundry service with cadence design kit and multi-project wafers

Automated test

The infrastructure of Fraunhofer IMS allows for extensive development support beginning with feasibility studies over prototype development up to pilot production:

• Test program development for acquisition of optimal analog performance and maximum mixed-signal test coverage
• Knowledge and expertise of automated test equipment (ATE)
• Automated and manual process parameter characterization
• Automated mixed-signal component test on wafer bsis and with support of our pick-and-place facilities on the basis of housed components. Quantities of up to several millions possible
• Testing and measuring of layer thickness, layer resistance, optical thin film measurement, particle measurement, optical CD and overlay and wafer geometry
• Error analysis
• Pull- and shear-tests
• Reliability analysis, like temperature change, HAST and pressure chamber, changing temperature conditions as well as aging and cycle tests

Assembly

Fraunhofer IMS offers new packaging solutions for your sensors, MEMS and ICs:

• Package evaluation and developments
• Demonstrators and prototype assembly
• Pre-production of low to medium quantities and transfer to mass production
• Ceramic housing of high reliability
• Installation into plastic housing in cooperation with competent partners
• Special housing
• Chip scale packaging and vacuum packaging
• Wafer thinning of up to 50 μm
• Customer-specific separation of wafers
• Chip-on-board installation and PCB development
• Die and wire bonding for a temperature range of up to 300 °C
• Encapsulation with glob-top
• Wafer level packaging