Cooperation Models for ASICs

Our cooperation models in the field ASICs offer tailor-made service packages for the realization of your ideas. We will gladly test the benefits of an ASIC development in feasibility studies, work out the necessary specification documents and identify the respective target technology. We implement your idea into silicon and assume test development and test (wafer & components) as well as reliability tests and qualifications.

Everything from one provider

ASIC auf Fingerkuppe
© Fraunhofer IMS
ASIC auf Fingerkuppe

Our cooperation models cover almost the whole range regarding the subject field ASICs. With your cooperation we can deduce and develop the exact specifications that are needed for the goal achievement in your individual use case. We carry out cost analyses – depending on specifications and quantity – to choose the suitable goal technology for your ASIC. For this purpose we can rely on a broad spectrum of experience in various technology nodes from different providers. If a completed specification is available, we can quickly convert it into silicon. Together with our experienced employees from the fields of analog technology, digital design and mixed-signal electronics, we can implement your wishes. In this development phase we work with the latest customary methods and software tools in the areas of design and verification.

Our test development department ensures an excellent testability of the functional chip parameters from the start and optimizes the circuit accordingly. This way, we can keep the machine run time for wafer and component tests at a low level to allow for competitive prices in your target market. These tests are carried out at Fraunhofer IMS in our in-house test laboratory. During this process, we benefit from our experiences from series testing in various other projects. For this, we work with modern test systems for wafer and component tests as well.

We also offer reliability tests/qualifications of ASICs. This includes tests like latch-up, ESD, high temperature bearing tests (HTS) and high temperature load tests (HTOL). The results and our assessments are presented to you in an extensive report.

Thus, everything regarding the ASICs is available at Fraunhofer IMS.

Our cooperation models in the field of ASICs:

  • Specification development according to customer requirements
  • ASIC design according to customer requirements
  • ASIC production (in-house or foreign foundry)
  • Assembly in ceramics or synthetic material
  • Test development and test implementation for wafers and assembled components
  • Reliability tests ISO, AEC or DIN

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Services & Know-how

We support you with our extensive experience in design and production of microelectronics for innovative products.

Infrastructure

Our equipment for the field of ASICs at Fraunhofer IMS offers solutions from the development up to the verified product of your project.

 

Overview Pages

ASICs (Home)

We offer analog, digital and mixed-signal ASIC and IC design solutions for reliable and trustworthy electronics

Applications

We offer applications for ASIC and IC design solutions from the fields of industry, medical technology, automotive and logistics.

Technologies

Fraunhofer IMS offers ready for use solutions and IP for the integration into your ASIC for many different areas.

Customer Benefits

We develop ICs for industrial sensor systems, automotive and medical technology and are the ideal partner for customer-specific IC-/ASIC-based electronic systems.

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