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ASICs HF transponder for Industry 4.0 applications |
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If you need more functionality or more safety on the transponder, then contact us. We would be happy to develop a full-custom transponder for your application. For example, crypto functions based on Physical Unclonable Functions can provide hardware-level protection. Built-in encryption mechanisms can protect internal storage or protect IP. This enables the increasing need for safety to be realized.
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Wireless and Transponder Systems Drones4Energy - Infrastructure Monitoring |
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ASICs Trustworthy embedded AI with RISC-V |
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Embedded Systems News AIfES Demonstrator |
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Current topics in AIfES development include compatibility with existing machine learning frameworks, such as: For example, TensorFlow® can be used to transfer pre-trained neural networks to AIfES or the integration of reinforcement learning algorithms specifically for embedded systems. In the latter case, the use of the IMS RISC-V core with AI hardware accelerators is particularly interesting in order to learn quickly and efficiently. Students have the possibility to do there Bachelor or Master Theses in the environment of Embedded-KI development at the Fraunhofer IMS. Visit our Career Page.
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High Temperature Electronics Innovation on Silicon |
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CMOS Image Sensors Great Sucess for the Fraunhofer IMS at AutoSens in Bruessels |
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Many discussions with experts from the automotive industry are confirming that the new LiDAR approach with backside-illuminated SPAD arrays has great potential for application in autonomous driving scenario. In an interview Werner Brockherde explained the new technology based on optimized CSPAD technology and wafer bonding. Prototype detector arrays are expected to be available before end of this year.
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Events & Fairs |
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CMOS Image Sensors CSPAD technology for LiDAR: Coming conferences and new sensor solutions |
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Secondly, the LiDAR-team presents new SPAD solutions at the SPIE Photonics West in San Francisco (1-6 February 2020): Improve your understanding of LiDAR and attend to two scientific talks (paper 11288-5 and 11288-9) or the poster session (paper 11288-94) and start fruitful discussions with our experts. |
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18.11 - 21.11.19 in Düsseldorf, Hall 8A - Booth F19 COMPAMED |
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This includes the Shunt Sensor – an implantable sensor that measure intracranial pressure in the shunt system of hydrocephalus patients. Another new development is the Taktile Hand, which integrated pressure sensor technology into a hand. A third product is the Theranostic Implant that features several sensors, like pressure, temperature and positions sensors controlled by ASIC. The scientists also showcase their AI solutions with a sensor-related system that recognizes handwriting and gestures.
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26.11 - 28.11.19 in Nuremberg, Hall 7A - Booth 301 sps – smart production solutions |
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• Energy-autonomous wireless current sensor for condition monitoring on 3-phase cables and connections • SHF transponder - tool identification with pulse readout • Micro Intelligence - Artificial intelligence for 3D gesture recognition and control Inductive position sensors - simple, cost-effective and precise position measurement HT Proximity Switch - High temperature proximity switch with improved performance • Uncooled infrared sensors (microbolometers) and cameras for high sensitivity and temperature resolution in the IR range of 3 - 14μm • IRFPA - object and person acquisition without artificial lighting • SPAD-LiDAR camera Owl for reliable and fast distance measurements for lines and area sensors
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Contact |
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Michael Bollerott Head of Marketing and Sales Fraunhofer Institute for Microelectronic Circuits and Systems Finkenstr. 61 47057 Duisburg, Germany Phone +49 203 3783-227
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