In addition to the CMOS line Fraunhofer IMS operates its own microsystems technology line (MST Lab&Fab), which enables the post-processinf of CMOS wafers and the integration of micromechanical, optical or other structures on the wafer to create new components.
The microsystem technology (MST) and microelectronics become closely interlinked when it comes to the creation of compact, ”intelligent” sensors and actuators. MST should be seen as an extension of the CMOS technology: CMOS provides the electronics and MST delivers the sensor and actuator functions.
MST processes use semiconductor manufacturing equipment and profit from the diverse experience that the silicon semiconductor technology has built. If there are very small systems requested, small signals to be read out on short routes or there are arrays of sensors, the integration of the MST structures directly on the CMOS is recommended. The application possibilities of CMOS technology can be extended significantly without depending on expensive scaling to minute structures. That is why we at Fraunhofer IMS built our Microsystems Lab&Fab with the support of the state of NRW, the BMBF and the EU. In our facilities we use post-processing on CMOS to develop production processes and complete intelligent microsystems for our customers.
Infrastructure of Microsystems Lab&Fab
The infrastructure of the MSTLab&Fab provides various development possibilities and allows for the complete mapping of complex MST processes on 200 mm discs. Apart from the high-resolution lithography and modern etching processes (isotropic etching with HF and XeF2 for sacrificial layers, deep etching for TSVs), there are various possibilities for the deposition of ultrathin functional layers with ALD (Atomic Layer Deposition) to be mentioned as well.