Microsystems technology and microelectronics merge closely to create compact “intelligent“ sensors and actors. The Microsystems technology (MST or MOEMS micro opto electro-mechanical systems) expands the CMOS-technology. MST provides sensor and actor functions, CMOS supplies the electronics. MST processes use semiconductor equipment and benefit from the versatile experience which has been built up by the silicon semiconductor technology.
If very small systems are needed, small signals have to be read out over a distance as short as possible, or if you have an array of sensors, the integration of the MST structures directly on the CMOS is suitable. By this, the application possibilities of CMOS technology can be largely extended without falling back on expensive scaling to smallest structures.
Therefore, the IMS has built up its MST Lab&Fab with the support of the Land NRW, the BMBF and the EU. In this facility we use post-processing on CMOS to develop production processes and complete intelligent microsystems for our customers.
CMOS wafer serve as “intelligent” substrates with analogue and digital trigger, read out or interface circuits up to wireless sensor data transmission. Layers, structures and devices are directly integrated on theses substrates. The results are compact “intelligent” single-chip microsystems.
In comparison to the CMOS line, a great variety of materials is available (e.g. Cu, amorphous SiGe, AI2O3). The choice of the substrate can be made flexibly. We gladly offer our CMOS wafer with approved interface. Post-processing on customer wafers with 200 m Ø is also possible. The equipment of the MST Lab&Fab offers versatile development possibilities.
The IMS is your professional partner in the development of process steps, process modules and complete microtechnical sensor systems.