Various semiconductor technologies are available for the development of pressure sensor systems at Fraunhofer IMS. Our broad infrastructure includes a certified CMOS clean room of automotive industry standards for manufacturing of monolithic integrated pressure sensors. Systems that are realized with this technology are so-called 1-chip systems that have the read-out circuit and the pressure sensor produced in a 1.2 µm technology and housed on one chip.
Furthermore 2-chip pressure sensor systems can be realized, in which the interface ASIC in a 0.35 µm technology and the pressure sensors of the above-mentioned greater technology are being produced. The ASIC read-out circuit and the sensors are assembled via in-house installation and connection technology.
Besides the CMOS production line, the Microsystems Technology (MST) Lab&Fab is established as well. This second clean room provides the possibility to realize 1-chip systems by mounting, for example pressure-sensitive diaphragms directly onto the existing ASIC via post-CMOS processing. This post-CMOS process has been developed at Fraunhofer IMS and is conveniently executed on 200-mm CMOS wafers in our MST-Lab&Fab. This opens new possibilities to mount post-CMOS sensor elements subsequently onto the read-out circuit which can be produced externally in even smaller CMOS technologies (e.g. 0.18 µm).