Our services cover the complete front end manufacturing of your individual pressure sensor systems in our in-house clean rooms – from the concept development up to design and production. The combination of our CMOS and post-CMOS technologies allows for the integration of sensor chips and readout circuits on 1-chip or 2-chip systems.
Moreover, Fraunhofer IMS offers a wide range of services for back-end processing of your pressure sensor systems. Our know-how includes sawing, thinning an testing of wafers, as well as various assembly and connection techniques for the integration of isolated chips on circuit boards (PCBs). In addition, we offer validation of your system with suitable test and measuring stations. These are developed according to your customer-specific requirements and transferred to your premises if required.
In conclusion, our services include the calibration of developed pressure sensor systems, as well as the implementation and evaluation of long-term measurements and comparative measurements of the pressure sensor systems you use.