Fraunhofer IMS provides a complete infrastructure in the business unit High Temperature Electronics from the IC design over production and test up to the assembly.
© Fraunhofer IMS
Fraunhofer IMS offers a complete infrastructure for the production, test and assembly of integrated high temperature ASICs. It is based on the 0.35 µm HT CMOS technology and is complemented by the microsystems technology Lab&Fab. On this basis HT circuits as well as sensors and actuators for the temperature range of up to 300 °C can be developed and manufactured.
For the realization of high temperature (HT) circuits there is a complete infrastructure available at Fraunhofer IMS for the circuit development, production including microsystems technology, the characterization and the circuit test and assembly.
The circuit development happens on the basis of standard development tools and can rely on an extensive component and circuit library. This way analog and digital functionalities as well as mixed-signal systems can be designed; synthesis tools allow for the realization of complex digital parts up to the embedded microcontroller.
Fraunhofer IMS produces the developed microelectronic circuits in the in-house clean room, which is equipped with devices commonly used in the industry and is professionally operated with an industrial partner.
For the realization of application-specific integrated high temperature circuits (ASICs) the institute has developed an in-house specific 0.35 µm SOI CMOS technology which is due to the small structure size leading in HT technologies worldwide. More CMOS process steps are offered in the microsystems technology clean room. Here, additional layers (e.g. gold on pads) can be deposited and MEMS structures can be realized. Therefore even 3D structures for sensors and actuators can be manufactured.
For the test and the characterization of the manufactured ASICs there are modernly equipped laboratories with professional equipment for the fully automated wafer and component test available. Within the framework of the Forschungsfabrik Mikroelektronik Deutschland (FMD) the abilities of a high temperature wafer prober is extended for test on wafer level in up to 300 °C.
In addition to the CMOS and MST clean room Fraunhofer IMS offers a broad spectrum of process steps in the area of back-end processing of microelectronic components and systems. Wafer from CMOS production can be thinned, separated and assembled. The assembly is usually carried out in suitable ceramic housing.
Fraunhofer Institute for Microelectronic Circuits and Systems