High Temperature Electronics

At Fraunhofer IMS we develop integrated circuits, sensors and actuators in a 0.35 µm SOI-CMOS high temperature technology and manufacture them in our in-house clean room.

Integrated Circuits for Temperatures up to 300 °C

The high temperature technology of Fraunhofer IMS allows for integrated circuits to be operated in temperatures of up to 300 °C.

We support you in the realization of microelectronic circuits and systems for application in up to 300 °C. Open up new fields of application with us or optimize your existing systems, for example regarding the performance, construction or cooling, through the use of high temperature resistant integrated circuits (HT-ICs) realized in an optimized high temperature SOI CMOS technology. Benefit from our development and production know-how.

Microelectronics are the key technology for a variety of products in our everyday lives. For the use in harsh environments, especially in high temperatures, conventional electronics quickly reach their limits and can only be reliably operated in up to 150 °C. However, sensors and actuators, for example, are required and implemented in significantly higher temperatures in industrial processes. Usually, these are built from purely passive components and the electronics are operated detached from the hot areas, which requires additional assembly space and limits the performance.

High temperature electronics are needed to process the signals of the sensors or actuators on-site in a space-saving way and with a high signal quality in hot areas. For this purpose Fraunhofer IMS has developed a high temperature resistant Silicon-on-Insulator (SOI) CMOS technology. On the basis of this technology the integrated high temperature electronics can be realized. Individual transistors are not isolated via diodes (pn junctions), but dielectrically via a buried oxide which reduces the leakage currents by up to three magnitudes. An additional optimization of the devices allows for a performant operation of integrated circuits in up to 300 °C. To further increase the reliability of high temperature electronics and to reduce the degradation through electromigration the technology is also equipped with tungsten instead of the generally used aluminum metallization. The minimal structure size of 0.35 µm and up to four metal layers allow for the realization of compact integrated systems including a small embedded microcontroller.

The realization of integrated circuits for a temperature range of up to 300 °C requires a good understanding of the temperature behavior of individual components and possible parasitic effects. Fraunhofer IMS offers an extensive know-how in design and realization of integrated high temperature electronics for the use in harsh environments and in temperatures of up to 300 °C. For the development there are suitable standard and IP libraries available which are continuously extended.

Fraunhofer IMS offers you support in designing and realizing your high temperature resistant application-specific ICs (HT ASIC) from the concept up to pilot production.

Overview Pages

Applications

Conducted projects in the area of analog and digital circuit development for high temperature applications

Technologies

We develop integrated circuits and sensors of high complexity for environmental temperatures up to 300 °C in SOI CMOS.

Customer Benefits

In the business unit High Temperature Electronics Fraunhofer IMS offers an extensive catalogue of customer benefits from the concept study up to the production.

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