Customized CMOS Processes

Fraunhofer IMS offers the development from a single sub-step to a complete customized CMOS process.

CMOS and CMOS-compatible processes

Fraunhofer IMS develops semiconductor devices and processes from the individual sub-step to a complete customized CMOS process. In addition to pilot production at the Fraunhofer IMS, these can also be implemented directly in customer CMOS lines.

Photo of two employees in the CMOS clean room
© Fraunhofer IMS

Professional CMOS Line

CMOS wafer with 4-layer metallization and planarized passivation
© Fraunhofer IMS

CMOS wafer with 4-layer metallization and planarized passivation

Front- and back-side of the double sided processed wafers
© Fraunhofer IMS

Front- and back-side of the double sided processed wafers

Experience and offers in the field of CMOS technology development at the Fraunhofer IMS

Fraunhofer IMS has more than 30 years of experience in CMOS technology development and a complete, professionally operated 200 mm CMOS line with various robust CMOS processes down to a development base with a structure size of 0,35 µm.

The IMS optimizes CMOS processes in the sense of the “More than Moore principle” by integrating additional functions such as high voltage resistant devices, high frequency circuits, sensors or by developing technologies that enable the use of the circuit under harsh conditions. The preparation of CMOS wafers as “intelligent” substrates by e. g. planarization is also an important development task. On these “intelligent substrates” layers are deposited and structured by post-CMOS processes to create new additional devices on the CMOS circuits.

Development of application- and customer-specific CMOS processes

Examples for the complete development of customer- and application-specific CMOS processes are the mixed signal 0.35 µm automotive CMOS process and  high temperature (300°C) processes. Accompanying processes and component simulations (TCAD) as well as electrical characterization including parameter extraction and reliability investigations are part of the activities of Fraunhofer IMS.

Another important field of activity is the integration of special devices and process modules into our own or the customers CMOS processes. This also applies, for example, sensors in form of optically sensitive devices such as SPADs (Single-Photon Avalanche Diodes) or pressure sensors. Our further fields of activities are circuit devices like non-volatile memories (EEPROM or flash cells) including specific circuit development as well as high voltage devices. Special process modules for UV-transparent passivation and the removal of dielectric layers over a photodiode with subsequent deposition of an anti-reflective coating are also part of the Fraunhofer IMS repertoire.

Besides the integration into the CMOS, Fraunhofer IMS is also engaged in the development of CMOS compatible processes for discrete devices such as SiPM (silicon photomultiplier), DEPFET (depleted p-channel field-effect transistor) or DOEs (diffractive optical elements), which also includes the development of corresponding interconnection technologies such as double-sided wafer processing.

Post CMOS process for sensor integration

Planarized CMOS surfaces serve as the basis for post-CMOS sensor integration. In combination with "Micro-Electro-Mechanical Systems" MEMS or "Nano-Electro-Mechanical Systems" NEMS, sensor elements such as optical, mechanical, physical, chemical and bio-sensors can also be realized. Examples are uncooled bolometer arrays and nanowire gas sensors. The combination of CMOS and MEMS (or NEMS) results in innovative and extremely compact microsystems for use in medicine, industry, automotive, aerospace and consumer applications.

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Overview Pages

Devices and Technologies (Home)

Fraunhofer IMS offers the optimal conditions for the development of innovative microelectronic and micromechanic devices and systems.

Applications

Overview of typical development projects in the field of Devices and Technologies

Technologies

Customer-specific CMOS process, high-temperature ICs, MEMS and post-CMOS processing, atomic layer deposition (ALD), 3D-Integration

Customer Benefits

Our offers for customer-oriented solutions – from the process development up series production

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