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Newsletter of Fraunhofer IMS 1/20
 
3D-Sensors
Future model of the German and European research landscape

 
 
 
The novel FMD concept for cross-site cooperation is successful. This is shown by a large-scale project "miniLIDAR", which was started at the end of 2019 and is being supported by the FMD office with an amount of 5.65 million Euros. In this project components of a miniaturized LiDAR for robotics are going to be developed in cooperation with an industrial partner.
Four FMD institutes are involved - the Ferdinand Braun Institute FBH in Berlin, the Fraunhofer Institute for Microelectronic Circuits and Systems IMS in Duisburg, the Fraunhofer Institute for Photonic Microsystems IPMS in Dresden and the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin.

MORE ABOUT CMOS IMAGE SENSORS
 
     
   
  
 
Transponder Systems
>>Top Cluster Industrial Innovations<< (SPIN)

 
 

 
As part of SPIN, Fraunhofer IMS initiates a project called FIT4ECHANGE to digitize the low voltage distribution network. With a future-proof power supply management, grid operators should be able to master the changes due to the energy turnaround and e-mobility. By making energy flows visible, grid usage forecasts can be made, grid-related load management is possible and new business models can be implemented. Predictive maintenance increases network availability and reduces costs for the repair.

 
     
 
 
 
 
For this purpose, the project partners are going to use existing network infrastructures for IoT applications and develop new types of intelligent sensor technology that is geared to the special requirements of measurement technology for distribution networks. Thus, the network operator receives a cost-effective solution for the area-wide monitoring of their network.

  PRESS RELEASES  
MORE ABOUT WIRELESS AND TRANSPONDER SYSTEMS
 
     
   
  
 
Mixed-Signal ICs
RFID ASIC with SPI Interface >>HF18<<

 
 
 
Fraunhofer IMS has developed a new, passive 13.56 MHz transponder ASIC “HF18”. This transponder ASIC is characterized by its SPI interface, which can be freely controlled via the HF interface. This enables the targeted use of different sensor transponders or the expansion of the memory. The external module is supplied without batteries via the transponder from the HF field.



 
     
 
 
 
 
Currently, the transponder is in its final evaluation phase. After the completion of the test phase an evaluation kit is available which can be used to test the functions and application possibilities. If you are already interested in our transponder ASIC HF18, or if you are interested in an evaluation kit, feel free to contact us. We will gladly discuss possible extensions of the ASIC with you, e. g. crypto or AI functions, in order to best serve your application.

  INFORMATION SHEET HF18  
MORE ABOUT ASICS
 
     
   
  
 
3D-Sensors
Wide Field-of-View LiDAR Demonstrator

 
 

 
In cooperation with the Fraunhofer Institute for Silicon Technology ISIT, the Ferdinand Braun Institute and the Leibniz Institute for High Frequency Technology FBH, Fraunhofer IMS supports the OQmented GmbH in the development of a MEMS mirror-based wide-angle LiDAR demonstrator for autonomous driving applications. The aim of the project is to detect distances in an angular range of more than 160° around the sensor.

  CMOS IMAGE SENSORS - LiDAR  
MORE ABOUT CMOS IMAGE SENSORS
 
     
   
  
 
Optical Sensors and Applications
Fraunhofer IMS is Partner in the ECSEL JU Project >>APPLAUSE<<

 
 

 
Advanced assembly and housing technology for photonics, optics and electronics for cost-effective production in Europe – this is the goal of the ECSEL Joint Undertaking project “APPLAUSE”. The gained technologies will be incorporated into six industrial applications. With the Post-CMOS processing of microbolometers for low-cost and high-performance thermal infrared image sensors and the development of a biocompatible and hermetic encapsulation on chip-level, the Fraunhofer Institute for Microelectronic Circuits and Systems IMS is participating in two of the six demonstrators.

  PRESS RELEASES  
MORE ABOUT PRESSURE SENSOR SYSTEMS
MORE ABOUT IR IMAGERS
 
     
   
  
 
Embedded Systems
AI Software Framework >>AIfES<< with Fixed-Point Arithmetic

 
 
 
The AIfES framework (www.aifes.de) has been expanded with the fixed-point arithmetic by Fraunhofer IMS and therefore enabling the use on platforms which don’t support floating-point arithmetic. This is the case in some digital signal processors (DSP).



 
     
 
 
 
 
This pens up completely new application areas for the use of neural networks. Compatibility with existing machine leraning frameworks, such as TensorFlow®, will also be further optimized to easily port pre-trained networks to embedded systems. The AIfEs development team has equipped the demonstrator for the complex gesture recognition with LoRA as a new communication interface. Thus, communication between the remote control with gesture recognition and the central computer is possible over great distances and without direct visual contact. This enables the use especially in more difficult environments.

  ARTIFICIAL INTELLIGENCE FOR EMBEDDED SYSTEMS - AIFES  
MORE ABOUT ELECTRONIC ASSISTANCE SYSTEMS
 
     
   
  
 
Events & Fairs

 
   
  
 
16.06 - 18.06.2020 in Berlin
DMEA

 
 

 
Due to the Corona virus and the associated restrictions, the DMEA will only take place virtually this time.
The trade fair company is currently working on the implementation and we want to be represented virtually there.

A contactless respiratory rate detection with the help of a camera shows which innovations are possible in the field of medicine. The system simplifies the recording and evaluation of important vital parameters without connecting the patient to an electronic system.

More information can be found here
 
     
   
  
 
23.06 - 25.06.2020 In Nürnberg
SENSOR+TEST

 
 

 
Due to the Corona virus, large events are probably not allowed until the end of August. We suppose that the Sensor + Test does not take place in the previously known form. We'll keep you up to date.

Embedded artificial intelligence is the core feature of almost all exhibits by Fraunhofer IMS. From the μC with integrated AI core over the evaluation of measured values up to gesture recognition of robots shows the range of applications.

More information can be found here
 
     
   
  
 
Contact

 
 


 

Michael Bollerott
Head of Marketing and Sales

Fraunhofer Institute for Microelectronic
Circuits and Systems
Finkenstr. 61
47057 Duisburg, Germany

Phone +49 203 3783-227

Send e-mail

 
     
 
 
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